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Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era TOKYO, Japan, March 25, 2025 — Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it signed a Memorandum of Cooperation with Quest Global Services PTE. Ltd. As part of the agreement, Rapidus will become Quest Global’s new semiconductor foundry partner, enabling it to provide a wide range of solutions to its customers. Quest Global customers will be able to leverage Rapidus’ 2nm gate-all-around (GAA) manufacturing process to develop engineering design and manufacturing solutions that will support growing industry demand for low-power artificial intelligence (AI) semiconductors. Together, the two companies will deliver transformational silicon solutions as a virtual integrated device manufacturer (IDM) model for fabless companies. The AI semiconductor industry is in its early stages, with applications jus...

Japanese government-backed foundry Rapidus Inc. has denied media reports on plans to deliver 2-nanometer chip prototypes to US-based fabless semiconductor company Broadcom in 2025.  

TOKYO and HOKKAIDO, Japan, Oct. 3, 2024 – Rapidus Corporation, a company backed by the Japanese government, involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS). The Seiko Epson Chitose Plant is adjacent to the Rapidus Innovative Integration for Manufacturing (IIM) foundry, the semiconductor manufacturing facility that Rapidus is currently building in Bibi, Chitose City. The new R&D space was unveiled at a groundbreaking ceremony held today, with the clean room amassing an area of approximately 9,000m2 (96,875 square feet). Leveraging the new R&D facility, Rapidus will develop mass production technologies for chiplet packages. Rapidus will begin installing manufacturing equipment in April 2025,...